JoinCuNext

Project description

The JoinCuNext project aims to develop and research a cost-effective and environmentally friendly sintering paste designed for multivariate use in die attach or via filling applications and thick film printing, among others. The project consists of the following work packages:

• Specification and industry requirements: Specification of process parameters, characterization methods and test patterns.
• Development and production of copper flakes with formate coating
• Development of a copper sinter paste: sinter paste for bonding the paste to the substrate (metallic/ceramic)
• Characterization & test: Technical Readiness Level (TRL) 4 for sinter paste and process
• Construction of demonstrator modules and verification of the specifications defined in AP1 on complete test modules

Project information